Substrates having features formed therein and methods of...

Details Substrates having features formed therein and methods of... Substrates having features formed therein and methods of...

2005-08-16

2005-08-16

Thompson, Craig A. (Department: 2813)

Semiconductor device manufacturing: process

Chemical etching

Liquid phase etching

Reexamination Certificate

active

06930055

ABSTRACT:
The described embodiments relate to substrates having features formed therein and methods of forming same. One exemplary method forms a blind feature through a majority of a thickness of a substrate, the blind feature being defined by at least one sidewall surface and a bottom surface. The method also applies an etch resistant material to the blind feature and removes the etch resistant material from at least a portion of the bottom surface. The method further wet etches the substrate at least through the bottom surface sufficient to form a through feature through the thickness of the substrate.

REFERENCES:
patent: 6402301 (2002-06-01), Powers et al.
patent: 6554403 (2003-04-01), Chen et al.
patent: 6555480 (2003-04-01), Milligan et al.
patent: 2003/0027426 (2003-02-01), Milligan et al.
patent: 2003/0142185 (2003-07-01), Donaldson et al.
patent: 2004/0055145 (2004-03-01), Buswell

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