Surface mounting semiconductor device

Details Surface mounting semiconductor device Surface mounting semiconductor device

2005-05-03

2005-05-03

Flynn, Nathan J. (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S666000, C257S676000, C257S796000, C257S675000, C257S705000, C257S706000, C257S775000, C257S787000, C257S692000, C257S684000

Reexamination Certificate

active

06888231

ABSTRACT:
A semiconductor device includes a semiconductor chip, an external connection electrode connected to the chip and a resin package for covering the chip. The resin package includes a mounting surface which faces a supporting substrate. The electrode includes a thick portion and a thin portion. The thick portion is partially exposed to the outside at the mounting surface of the package.

REFERENCES:
patent: 5028741 (1991-07-01), Sanders et al.
patent: 5150193 (1992-09-01), Yasuhara et al.
patent: 5521429 (1996-05-01), Aono et al.
patent: 5977613 (1999-11-01), Takata et al.
patent: 6081029 (2000-06-01), Yamaguchi
patent: 01128896 (1989-05-01), None
patent: 11-345917 (1999-12-01), None

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