Multi-chip module packaging device using flip-chip bonding...

Details Multi-chip module packaging device using flip-chip bonding... Multi-chip module packaging device using flip-chip bonding...

2005-08-23

2005-08-23

Zarabian, Amir (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Wire contact, lead, or bond

C527S315000, C527S315000

Reexamination Certificate

active

06933616

ABSTRACT:
The present invention discloses a multi-chip module packaging device which has outward extension portions of under bump metallurgies (UBM) for satisfying the bonding area requirement during wire bonding operation. Therefore, chips have electrical connections with metal bonding wires welded on the extended portions for transmitting electrical signals between each other. That is, the number of circuit layers of the substrate used in the device can be reduced; furthermore save on the production cost.

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