Method for forming an electrical structure

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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Details

C029S831000, C029S841000, C029S842000, C029S846000, C361S762000

Reexamination Certificate

active

06868604

ABSTRACT:
A method for forming an electrical structure. A substrate and a compliant layer are provided. A plated through hole (PTH) is formed through the compliant layer. A top pad is formed on a top surface of the compliant layer, wherein the top pad is electrically coupled to the PTH. A bottom pad is formed on a bottom surface of the compliant layer, wherein the bottom pad is electrically coupled to the PTH. A mask layer is applied to the bottom surface of the compliant layer, wherein the mask layer covers the bottom pad and an end of the PTH. The compliant layer is joined with the substrate, mechanically and electrically at the top pad. The portion of the mask layer is removed, wherein a portion of the bottom pad is exposed.

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