Multi-level stamper for improved thermal imprint lithography

Details Multi-level stamper for improved thermal imprint lithography Multi-level stamper for improved thermal imprint lithography

2005-03-22

2005-03-22

Lechert, Jr., Stephen J. (Department: 1732)

Plastic and nonmetallic article shaping or treating: processes

Mechanical shaping or molding to form or reform shaped article

Deforming the surface only

C264S106000, C264S107000, C425S385000, C425S394000

Reexamination Certificate

active

06869557

ABSTRACT:
A stamper/imprinter for use in performing thermal imprint lithography of a substrate/workpiece surface to form a pattern of features in first portions of the surface intended to receive the pattern, without incurring random formation of undesired, disordered features in second portions of the substrate/workpiece surface not intended to receive the pattern, comprising an imprinting surface configured to substantially prevent formation of gaps between the imprinting surface and the second portions of the surface during stamping/imprinting. Embodiments include stampers/imprinters with a multilevel imprinting surface comprises a first portion having a first level for forming the pattern of features in the first portions of the surface and a second portion having a second level for substantially preventing formation of gaps between the imprinting surface and the second portions of the surface during stamping/imprinting.

REFERENCES:
patent: 6753130 (2004-06-01), Liu et al.
patent: 6757116 (2004-06-01), Curtiss et al.

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