Method of forming the integrated circuit having a die with...

Details Method of forming the integrated circuit having a die with... Method of forming the integrated circuit having a die with...

2005-09-20

2005-09-20

Smoot, Stephen W. (Department: 2813)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S108000, C438S613000, C438S617000

Reexamination Certificate

active

06946321

ABSTRACT:
A semiconductor integrated circuit with high Q inductors and capacitors is disclosed. A semiconductor electrical circuit is formed on a first die, while micro-electromechanical structures having inductance and capacitance are formed on a second die. The second die is attached and electrically connected to the first die as a flip chip.

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