Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates
Reexamination Certificate
2005-08-16
2005-08-16
Everhart, Caridad (Department: 2825)
Semiconductor device manufacturing: process
Bonding of plural semiconductor substrates
C438S456000, C257S618000, C257S706000
Reexamination Certificate
active
06930021
ABSTRACT:
A method of manufacturing a mask includes: attaching a second substrate having a plurality of penetrating holes to a first substrate having an opening. The second substrate is attached such that the penetrating holes are positioned within the opening. A groove is formed on a surface of the first substrate facing the second substrate. The groove is utilized to form a flow path between the first and second substrates.
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Everhart Caridad
Oliff & Berridg,e PLC
Seiko Epson Corporation
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