Mask and method of manufacturing the same,...

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates

Reexamination Certificate

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C438S456000, C257S618000, C257S706000

Reexamination Certificate

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06930021

ABSTRACT:
A method of manufacturing a mask includes: attaching a second substrate having a plurality of penetrating holes to a first substrate having an opening. The second substrate is attached such that the penetrating holes are positioned within the opening. A groove is formed on a surface of the first substrate facing the second substrate. The groove is utilized to form a flow path between the first and second substrates.

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patent: WO 92/16822 (1992-10-01), None

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