Integrated circuit chip module

Details Integrated circuit chip module Integrated circuit chip module

2005-08-30

2005-08-30

Clark, S. V. (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S784000

Reexamination Certificate

active

06936914

ABSTRACT:
On the circuit surfaces of integrated circuit chips, there are adjacently laid out a power source pad for a power source wire at a plus voltage side and a power source pad for a power source wire at a minus voltage side. On a single-surface printed wiring board, a first set of two power source wires and a second set of two power source wires respectively are flip-chip mounted to two power source pads of the integrated circuit chips. The first and second sets of the power source wires are substantially parallel to each other, with substantially constant wire widths and with a substantially constant wire interval. Near the outer periphery of the printed wiring board, the first and second sets of the power source wires are bent smoothly and follow the periphery of the printed wiring board.

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