Method and apparatus for broadband optical end point...

Details Method and apparatus for broadband optical end point... Method and apparatus for broadband optical end point...

2005-04-05

2005-04-05

Turner, Samuel A. (Department: 2877)

Optics: measuring and testing

By light interference

For dimensional measurement

Reexamination Certificate

active

06876455

ABSTRACT:
A method for determining a film thickness in a semiconductor substrate is provided. The method initiates with providing multiple layers on the semiconductor substrate. Then, two reflectance spectra are generated where each of the two reflectance spectra are associated with different time periods while an upper layer is being removed. Next, a difference between the two reflectance spectra is calculated. Then, a curve is defined from the difference between the two reflectance spectra. Next, the defined curve is fitted by a known parametric function to determine the film thickness. An endpoint detector and a CMP system are also provided.

REFERENCES:
patent: 4680084 (1987-07-01), Heimann et al.
patent: 5440141 (1995-08-01), Horie
patent: 6275297 (2001-08-01), Zalicki

Affiliated with

Also associated with

Rating

Method and apparatus for broadband optical end point... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for broadband optical end point..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for broadband optical end point... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3439687