Method and apparatus for picking up a semiconductor chip,...

Details Method and apparatus for picking up a semiconductor chip,... Method and apparatus for picking up a semiconductor chip,...

2005-03-22

2005-03-22

Dillon, Jr., Joe (Department: 3651)

Material or article handling

Device for emptying portable receptacle

Nongravity type

C198S493000

Reexamination Certificate

active

06869264

ABSTRACT:
A method and apparatus for picking up a semiconductor chip, a method and apparatus for removing a semiconductor chip from a dicing tape, and a method of forming a perforated dicing tape are provided. Air may be blown through air holes in a dicing tape to at least partially separate the semiconductor chip from the dicing tape and/or create a space between the semiconductor chip to weaken the adhesion of the dicing tape to the semiconductor chip. The semiconductor chip may then be picked up by a removal member and completely removed from the dicing tape. Semiconductor chips that are not to be removed may be vacuum-suctioned to the dicing tape. UV radiation or heat may be applied to weaken the adhesion of the dicing tape. The semiconductor chip may be detected by an optical detector. Removing the semiconductor chips by air reduces stress and damage to the semiconductor chips.

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patent: 2000-31043 (2000-06-01), None
Korean Office Action, Notice to Submit Response, Aug. 18, 2004.

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