Methods of manufacturing devices having substrates with...

Details Methods of manufacturing devices having substrates with... Methods of manufacturing devices having substrates with...

2005-10-25

2005-10-25

Zarabian, Amir (Department: 2822)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

Thinning of semiconductor substrate

C438S977000, C257S690000, C257S618000

Reexamination Certificate

active

06958285

ABSTRACT:
In some embodiments, a fabrication method comprises: forming a structure that has one or more substrates, wherein the one or more substrates are either a single substrate or a plurality of substrates bonded together, wherein the structure comprises a non-electronically-functioning component which includes at least a portion of the one or more substrates and/or is attached to the one or more substrates; wherein the one or more substrates include a first substrate which has: a first side, an opening in the first side, and a conductor in the opening; wherein the method comprises removing material from the structure so that the conductor becomes exposed on a second side of the first substrate. In some embodiments, the second side is a backside of the first substrate, and the exposed conductor provides backside contact pads. In some embodiments, the fabrication method comprises: forming a structure comprising a first substrate which has: a first side, an opening in the first side, and a conductor in the opening; removing material from the structure so that the conductor becomes exposed on a second side of the first substrate; wherein removing of the material comprises removing the material from a first portion of the second side of the first substrate to cause the first portion to be recessed relative to a second portion of the second side of the first substrate.

REFERENCES:
patent: 4463336 (1984-07-01), Black et al.
patent: 4733290 (1988-03-01), Reardon et al.
patent: 4870745 (1989-10-01), Lee
patent: 5270261 (1993-12-01), Bertin et al.
patent: 5453404 (1995-09-01), Leedy
patent: 5472539 (1995-12-01), Saia et al.
patent: 5475318 (1995-12-01), Marcus et al.
patent: 5628917 (1997-05-01), MacDonald et al.
patent: 5659195 (1997-08-01), Kaiser et al.
patent: 5798283 (1998-08-01), Montague et al.
patent: 5880921 (1999-03-01), Tham et al.
patent: 5904496 (1999-05-01), Richards et al.
patent: 5919548 (1999-07-01), Barron et al.
patent: 5932940 (1999-08-01), Epstein et al.
patent: 5944537 (1999-08-01), Smith et al.
patent: 5963788 (1999-10-01), Barron et al.
patent: 6012336 (2000-01-01), Eaton et al.
patent: 6037667 (2000-03-01), Hembree et al.
patent: 6054335 (2000-04-01), Sun et al.
patent: 6061169 (2000-05-01), Feldman et al.
patent: 6071426 (2000-06-01), Lee et al.
patent: 6072608 (2000-06-01), Psaltis et al.
patent: 6075239 (2000-06-01), Aksyuk et al.
patent: 6076256 (2000-06-01), Drake et al.
patent: 6084777 (2000-07-01), Kalidas et al.
patent: 6094244 (2000-07-01), Kawata et al.
patent: 6097140 (2000-08-01), Miller et al.
patent: 6116756 (2000-09-01), Peeters et al.
patent: 6116863 (2000-09-01), Ahn et al.
patent: 6126846 (2000-10-01), Silverbrook
patent: 6142358 (2000-11-01), Cohn et al.
patent: 6147397 (2000-11-01), Burns et al.
patent: 6149190 (2000-11-01), Galvin et al.
patent: 6184060 (2001-02-01), Siniaguine
patent: 6322903 (2001-11-01), Siniaguine et al.
patent: WO 98/18337 (1998-05-01), None
patent: WO 98/19337 (1998-05-01), None
J. Eric Gulliksen, MST vs MEMS: Wher Are We?, , Semiconductor Magazine, Oct. 2000, vol. 1, No. 10, pp 1-7.

Affiliated with

Also associated with

Rating

Methods of manufacturing devices having substrates with... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Methods of manufacturing devices having substrates with..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods of manufacturing devices having substrates with... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3439408