Method for connection of circuit units

Details Method for connection of circuit units Method for connection of circuit units

2005-01-25

2005-01-25

Arbes, Carl J. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S740000, C029S834000, C029S835000

Reexamination Certificate

active

06845554

ABSTRACT:
The invention creates a method for connection of circuit units (101a-10n) which are arranged on a wafer (100), in which the wafer (100) is fitted to a first film (102a), the wafer (100) is sawn such that the circuit units (101a-101n) which are arranged on the wafer (100) are separated, the functional circuit units (101d) are picked up by means of a handling device (101) and are placed down on a second film (102b) by means of the handling device (103), so as to produce a separation distance which can be predetermined between connection contacts of the circuit units (101d).

REFERENCES:
patent: 5634267 (1997-06-01), Farnworth et al.
patent: 5640762 (1997-06-01), Farnworth et al.
patent: 5796264 (1998-08-01), Farnworth et al.
patent: 6219908 (2001-04-01), Farnworth et al.
patent: 20030110628 (2003-06-01), Frankowsky et al.
patent: 195 07 547 (1996-09-01), None
patent: 197 02 014 (1998-04-01), None
patent: WO 9602071 (1996-01-01), None
Peter Van Zant, “Microchip Fabrication A Practical Guide to Semiconductor Processing,” McGraw-Hill, 4th ed., A Division of The McGraw-Hill Companies (USA), p. 564, (2000).

Affiliated with

Also associated with

Rating

Method for connection of circuit units does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for connection of circuit units, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for connection of circuit units will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3438799