Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2005-01-18
2005-01-18
Lorengo, J. A. (Department: 1734)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C156S240000, C156S247000, C156S272200, C156S289000, C427S148000, C428S195100, C428S914000, C101S034000, C430S126200, C430S143000
Reexamination Certificate
active
06843875
ABSTRACT:
The invention is a process for forming a press proof (190) by forming an imaged receiver sheet (140) comprising a first thermoplastic layer (240) and a first support layer (160) by disposing an image (290) with a first density on the first thermoplastic layer (240) by using a laser thermal transfer (220); forming a pre-laminate comprising a second thermoplastic layer (250) and a second support layer (170); laminating the pre-laminate (260) to a medium and removing the second support layer (170) forming a supported pre-laminate (270); laminating the imaged receiver sheet (140) to the supported pre-laminate (270) changing the density of the image to a second density using a temperature that exceeds the glass transition point of the thermoplastic layer (230) and a speed of between 10 and 40 inches per minute forming a supported color proof (310); and removing the first support forming a color proof (300).
REFERENCES:
patent: 5053381 (1991-10-01), Chapman et al.
patent: 5300398 (1994-04-01), Kaszczuk
Creativepro.com, “Agfa Introduces SherpaMatic Duplex Proofing System”, Sep. 6, 2003, available at http://www.creativepro.com/story
ews/14387.html.
Buskop Law Group P.C.
Lorengo J. A.
LandOfFree
Density control through lamination does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Density control through lamination, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Density control through lamination will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3438258