Method and apparatus for die testing on wafer

Details Method and apparatus for die testing on wafer Method and apparatus for die testing on wafer

2005-10-11

2005-10-11

Pert, Evan (Department: 2826)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

Reexamination Certificate

active

06954080

ABSTRACT:
Integrated circuit die on wafer are tested individually, without probing any of the die, using circuitry (TC1-8, BC1-8, LR1-8, RR1-8, PA1-PA4) provided on the wafer.

REFERENCES:
patent: 5969538 (1999-10-01), Whetsel

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