Integrated circuit chip package with formable intermediate...

Details Integrated circuit chip package with formable intermediate... Integrated circuit chip package with formable intermediate...

2005-10-04

2005-10-04

Cuneo, Kamand (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S749000, C361S782000, C174S254000, C174S260000

Reexamination Certificate

active

06952352

ABSTRACT:
A formable wiring structure, an interposer with the formable wiring structure, a multichip module including the interposer and in particular a microprocessor and L2, L3 cache memory mounted on the interposer. The formable wiring structure includes wiring layers separated by dielectric layers. Attachment locations for attaching to module substrates, printed circuit cards or for mounting chips (microprocessor and cache) are provided on at least one interposer surface. The microprocessor is centrally located opposite a module attach location and the cache chips are on portions that are bent away from the module attach location to reduce and minimize module real estate required.

REFERENCES:
patent: 5206463 (1993-04-01), DeMaso et al.
patent: 5483421 (1996-01-01), Gedney et al.
patent: 6444921 (2002-09-01), Wang et al.

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