Semiconductor device with chamfered substrate and method of...

Details Semiconductor device with chamfered substrate and method of... Semiconductor device with chamfered substrate and method of...

2005-07-05

2005-07-05

Thompson, Craig A. (Department: 2813)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S126000, C257S774000, C264S272170

Reexamination Certificate

active

06913950

ABSTRACT:
A semiconductor device includes an insulating substrate, a cutout formed in side surfaces of the substrate, a conductive pad formed on the obverse surface of the substrate, an electrode formed on the reverse surface of the substrate, a semiconductor chip mounted on the substrate, and a connector which connects the pad to the electrode. The connector is arranged in the cutout.

REFERENCES:
patent: 4819041 (1989-04-01), Redmond
patent: 5212115 (1993-05-01), Cho et al.
patent: 5304844 (1994-04-01), Horiuchi et al.
patent: 5625222 (1997-04-01), Yoneda et al.
patent: 5834799 (1998-11-01), Rostoker et al.
patent: 5985695 (1999-11-01), Freyman et al.
patent: 6344609 (2002-02-01), Nakano
patent: 11-297752 (1999-10-01), None

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