Method for producing a semiconductor die package using...

Details Method for producing a semiconductor die package using... Method for producing a semiconductor die package using...

2005-05-10

2005-05-10

Williams, Alexander Oscar (Department: 2826)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S108000, C438S598000, C438S612000, C438S687000, C438S164000, C438S412000, C438S455000, C438S113000, C438S618000, C438S106000, C438S127000, C257S797000, C257S738000, C257S778000, C257S673000, C257S737000, C257S696000, C257S666000

Reexamination Certificate

active

06890793

ABSTRACT:
A method for producing a die package is disclosed. A bumped die comprises solder bumps mounted to a leadframe including a first lead comprising a first locating hole and a second lead comprising a second locating hole. The solder bumps are present in the first and second locating holes, and a molding material is formed around the die.

REFERENCES:
patent: 4808769 (1989-02-01), Nakano et al.
patent: 5049718 (1991-09-01), Spletter et al.
patent: 5214308 (1993-05-01), Nishiguchi et al.
patent: 5407864 (1995-04-01), Kim
patent: 5805422 (1998-09-01), Otake et al.
patent: 6037665 (2000-03-01), Miyazaki
patent: 6133065 (2000-10-01), Akram
patent: 6262513 (2001-07-01), Furukawa et al.
patent: 6281046 (2001-08-01), Lam
patent: 6309915 (2001-10-01), Distefano
patent: 6562657 (2003-05-01), Lin
patent: 20010007375 (2001-07-01), Fjelstad et al.
patent: 20030110626 (2003-06-01), Cobbley et al.

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