Method of manufacturing sheet material and method of...

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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Details

C204S912000, C427S096400, C427S097100

Reexamination Certificate

active

06889428

ABSTRACT:
The invention is to form plated films on a conductive foil a thigh precision, and simplify a procedure of forming the plated film. A resin film composed of a thermosetting resin is formed on the surface of the conductive foil. The resin film of parts which become bonding pads and die pads is eliminated by a laser etching. A clamper presses of the periphery of the block so as to form hermetically sealed spaces on the block. The interior of the clamper is filled with a plating liquid by means of an injection means and an evacuation means, and subsequently, and Ag plated film is formed by an electroplating method.

REFERENCES:
patent: 6562660 (2003-05-01), Sakamoto et al.
patent: 20030151135 (2003-08-01), Sakamoto et al.

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