Fluid pressure bonding

Details Fluid pressure bonding Fluid pressure bonding

2005-09-20

2005-09-20

Ghyka, Alexander (Department: 2812)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

C438S456000, C156S105000, C156S156000, C156S285000

Reexamination Certificate

active

06946360

ABSTRACT:
An improved method of bonding involves using direct fluid pressure to press together the layers to be bonded. Advantageously one or more of the layers are sufficiently flexible to provide wide area contact under the fluid pressure. Fluid pressing can be accomplished by sealing an assembly of layers to be bonded and disposing the assembly in a pressurized chamber. It can also be accomplished by subjecting the assembly to jets of pressurized fluid. The result of this fluid pressing is reduction of voids and enhanced uniformity over an enlarged area.

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