Semiconductor package with heat spreader

Details Semiconductor package with heat spreader Semiconductor package with heat spreader

2005-07-19

2005-07-19

Zarabian, Amir (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S625000, C257S675000, C257S705000, C257S707000, C257S712000, C257S713000, C257S717000, C257S720000, C257S930000

Reexamination Certificate

active

06919630

ABSTRACT:
A semiconductor package with an embedded heat spreader (EHS) is proposed, which can be used for the fabrication of a semiconductor package, such as a FCBGA (Flip-Chip Ball Grid Array) package with a heat spreader, and which is characterized by the provision of a plurality of recessed portions, either in the heat spreader attach area of the substrate, or in the support portion of the heat spreader, or in both, so as to allow the fill-in portions of the adhesive layer that are filled in these recessed portions to form anchor structures to benefit the heat spreader against crosswise shear stress. Moreover, since the provision of these recessed portions allows an increase in the contact area of the adhesive layer with the substrate and the heat spreader, it can help increase the adhesive strength to provide the heat spreader more securely adhered in position on the substrate.

REFERENCES:
patent: 5032897 (1991-07-01), Mansuria et al.
patent: 5289337 (1994-02-01), Aghazadeh et al.
patent: 5459368 (1995-10-01), Onishi et al.
patent: 5637920 (1997-06-01), Loo
patent: 5903052 (1999-05-01), Chen et al.
patent: 6093960 (2000-07-01), Tao et al.
patent: 6139975 (2000-10-01), Mawatari et al.
patent: 6225695 (2001-05-01), Chia et al.
patent: 6239487 (2001-05-01), Park et al.
patent: 6529379 (2003-03-01), Fuller et al.
patent: 6580611 (2003-06-01), Vandentop et al.
patent: 6773963 (2004-08-01), Houle
patent: 2002/0053724 (2002-05-01), Lai et al.
patent: 2002/0053731 (2002-05-01), Chao et al.
patent: 2003/0164505 (2003-09-01), Streubel et al.
patent: 2003/0178721 (2003-09-01), Lo et al.
patent: 2004/0124525 (2004-07-01), Colgan et al.
patent: 10294403 (1998-11-01), None

Affiliated with

Also associated with

Rating

Semiconductor package with heat spreader does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor package with heat spreader, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor package with heat spreader will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3429566