Method for fabricating a CMP pad having isolated pockets of...

Details Method for fabricating a CMP pad having isolated pockets of... Method for fabricating a CMP pad having isolated pockets of...

2005-05-03

2005-05-03

Aftergut, Jeff H. (Department: 1733)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C051S297000, C451S527000

Reexamination Certificate

active

06887336

ABSTRACT:
A method for fabricating a chemical mechanical polishing pad and a system and a method for using such a pad are described. The method comprises providing a continuously porous pad and forming non-porous regions on the pad in a pattern which segregates a pluarlity of porous regions from one another, wherein each of the porous regions includes a plurality of interconnected pores. The non-porous matrix may include a network of trenches, or may have pores which have been filled with a material. The material may include a polymer resin.

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