Method of manufacturing printed-circuit board

Details Method of manufacturing printed-circuit board Method of manufacturing printed-circuit board

2005-05-10

2005-05-10

Arbes, Carl J. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S825000, C029S846000

Reexamination Certificate

active

06889433

ABSTRACT:
By filling a predetermined amount of conductive paste into an opening for forming a through hole or a VH formed in a resin insulating layer of a circuit board, and pressurizing the filled conductive paste under the condition of reduced pressure, removing air bubble strapped in the conductive paste.

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