Single layer capacitor with dissimilar metallizations

Details Single layer capacitor with dissimilar metallizations Single layer capacitor with dissimilar metallizations

2005-07-12

2005-07-12

Thomas, Eric W. (Department: 2831)

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

C361S311000, C361S305000

Reexamination Certificate

active

06917509

ABSTRACT:
A single layer ceramic capacitor for wire bonding or solder or epoxy attachment wherein a bottom metallization is of a lesser purity than a top metallization whereby the bottom metallization may be effectively soldered without leaching of the metal and the top metallization may be wire bonded. In an exemplary embodiment, the top metallization is essentially pure gold and the bottom metallization is an alloy of gold and platinum and/or palladium. The top and bottom metallizations are provided on a dielectric body that advantageously comprises a ceramic having a sintering temperature below the melting point of gold. In a further exemplary embodiment, the capacitance of the capacitor may be enhanced by providing one or more interior metallization planes parallel to the exterior metallizations and connected thereto by conductive vias.

REFERENCES:
patent: 3275915 (1966-09-01), Harendza-Harinxma
patent: 3523224 (1970-08-01), Randall, Jr. et al.
patent: 4168519 (1979-09-01), Hertz
patent: 4439813 (1984-03-01), Dougherty et al.
patent: 4819128 (1989-04-01), Florian et al.
patent: 4864465 (1989-09-01), Robbins
patent: 5177663 (1993-01-01), Ingleson et al.
patent: 5220483 (1993-06-01), Scott
patent: 5353498 (1994-10-01), Fillion et al.
patent: 5576926 (1996-11-01), Monsorno
patent: 5590016 (1996-12-01), Fujishiro et al.
patent: 5599414 (1997-02-01), Roethlingshoefer et al.
patent: 5712758 (1998-01-01), Amano et al.
patent: 5757611 (1998-05-01), Gurovich et al.
patent: 5855995 (1999-01-01), Haq et al.
patent: 6125027 (2000-09-01), Klee et al.
patent: 6455453 (2002-09-01), Chikagawa
American Technical Ceramics,ATC Millimeter Wavelength Single Layer Capacitors, Brochure, 3 pp., Revised Feb. 1998.
Compex Corp,MICROWAVE Chip Capacitors, Brochure, 3 pp. publication date unknown.

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