PIPE STRUCTURE, ALIGNMENT APPARATUS, ELECTRON BEAM...

Data processing: generic control systems or specific application – Specific application – apparatus or process – Product assembly or manufacturing

Reexamination Certificate

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C138S114000

Reexamination Certificate

active

06915179

ABSTRACT:
A pipe structure includes a double pipe having a resin inner pipe and a resin outer pipe covering an outside of the inner pipe, and a discharge mechanism for discharging fluid in a space between the inner pipe and the outer pipe. The double pipe is used in a vacuum chamber having a vacuum atmosphere.

REFERENCES:
patent: 3743760 (1973-07-01), Sassin
patent: 4368219 (1983-01-01), Nagata et al.
patent: 4475223 (1984-10-01), Taniguchi et al.
patent: 4906496 (1990-03-01), Hosono et al.
patent: 4993696 (1991-02-01), Furukawa et al.
patent: 5611655 (1997-03-01), Fukasawa et al.
patent: 5829483 (1998-11-01), Tukahara et al.
patent: 5837316 (1998-11-01), Fuchita
patent: 5978578 (1999-11-01), Azarya et al.
patent: 6061174 (2000-05-01), Shiozawa et al.
patent: 6110274 (2000-08-01), Okuno
patent: 6246204 (2001-06-01), Ebihara et al.
patent: 6385497 (2002-05-01), Ogushi et al.
patent: 6440504 (2002-08-01), Akiyama
patent: 2001/0017164 (2001-08-01), Fukui et al.

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