Method of manufacturing an improved microelectronic package

Details Method of manufacturing an improved microelectronic package Method of manufacturing an improved microelectronic package

2005-04-12

2005-04-12

Trinh, Minh (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S592100, C029S606000, C029S831000, C174S050510, C336S092000, C361S782000

Reexamination Certificate

active

06877211

ABSTRACT:
A method of making a microelectronic package. The advanced microelectronic component package incorporates a specially shaped base element which holds and electrically separates the individual conductors associated with the microelectronic component(s) so that the individual conductors may be bonded to external package leads and other conductors within the package. In a first embodiment, jacketed, insulated wire is used as one winding of a toroidal transformer, while unjacketed insulated wire is used as another winding. The jacketing is stripped from the first winding and the exposed conductors are routed into channels along the sides of the base element. The unjacketed conductors are also routed into the same channels, where both conductors are bonded to the external package leads. Raised elements along the sides of the base provide the required electrical separation between the conductors during both manufacture and operation. A method of manufacturing the improved microelectronic package is also disclosed.

REFERENCES:
patent: 5015981 (1991-05-01), Lint et al.
patent: 5425166 (1995-06-01), Hastings et al.
patent: 5455741 (1995-10-01), Wai et al.
patent: 6225560 (2001-05-01), Machado
patent: 6642827 (2003-11-01), McWilliams et al.
patent: 6691398 (2004-02-01), Gutierrez

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