Method for manufacturing nonreciprocal circuit device,...

Details Method for manufacturing nonreciprocal circuit device,... Method for manufacturing nonreciprocal circuit device,...

2005-04-19

2005-04-19

Jones, Stephen E. (Department: 2817)

Metal working

Method of mechanical manufacture

Electrical device making

C333S001100, C333S024200, C029S601000

Reexamination Certificate

active

06880227

ABSTRACT:
A highly reliable nonreciprocal circuit device can be easily manufactured at low cost. In the nonreciprocal circuit device, a resin layer is formed on the surface of a metal case. On a ferrite member, the terminals of central conductors are arranged with a predetermined angle therebetween. Inside a resin case including input/output terminals and ground terminals, there are arranged the ferrite member, the central conductors, a permanent magnet for applying a static magnetic field to the ferrite member and the central conductors, a resistor, and capacitors. The resin case is sandwiched by an upper yoke and a lower yoke. A resin layer formed of a thermosetting resin is arranged on each of the yokes. When the permanent magnet is thermally demagnetized, the thermosetting resin layer is hardened at the same time.

REFERENCES:
patent: 20020097104 (2002-07-01), Nakagawa et al.
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patent: 10-200307 (1998-07-01), None
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patent: 10242713 (1998-11-01), None
patent: 2000-114818 (2000-04-01), None

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