Process of thinning and blunting semiconductor wafer edge...

Details Process of thinning and blunting semiconductor wafer edge... Process of thinning and blunting semiconductor wafer edge...

2005-04-26

2005-04-26

Fourson, George (Department: 2823)

Metal treatment

Barrier layer stock material, p-n type

Reexamination Certificate

active

06884303

ABSTRACT:
A wafer having a rounded edge is thinned to 100 microns or less, producing a tapered razor like edge. The edge is ground to blunt it and reduce danger to personnel and equipment during handling of the wafer.

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