Electronic module having a plastic housing with conductive...

Details Electronic module having a plastic housing with conductive... Electronic module having a plastic housing with conductive...

2005-07-19

2005-07-19

Coleman, W. David (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Reexamination Certificate

active

06919221

ABSTRACT:
The electronic module whose electronic components are connected by conductor tracks has a housing with a base body housing made of electrically non-conductive plastic. The base body housing is provided with recessed conduits on the inside surface of its housing wall, and a galvanizable plastic is introduced into these conduits. The conductor tracks are formed by a metallization applied onto the galvanizable plastic and they can run three-dimensionally along different wall sections of the base body housing.

REFERENCES:
patent: 4499519 (1985-02-01), Fishman
patent: 4504012 (1985-03-01), Fetty et al.
patent: 4627678 (1986-12-01), Biswas
patent: 4689103 (1987-08-01), Elarde
patent: 4758459 (1988-07-01), Mehta
patent: 5659153 (1997-08-01), Narayan et al.
patent: 6521830 (2003-02-01), Platz
patent: 6796851 (2004-09-01), Trogisch et al.
patent: 2003/0021541 (2003-01-01), Carpenter
patent: 2003/0179550 (2003-09-01), Nebrigic et al.
patent: 9300867 (1994-07-01), None
patent: 4416986 (1995-05-01), None
patent: 4447631 (1998-09-01), None
patent: 19755155 (1999-06-01), None
patent: 19944383 (2001-04-01), None
patent: 1085787 (2001-03-01), None

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