Abrading – Abrading process – Glass or stone abrading
Reexamination Certificate
2005-09-13
2005-09-13
Hail, III, Joseph J. (Department: 3723)
Abrading
Abrading process
Glass or stone abrading
C451S037000, C451S060000, C451S287000, C451S288000, C451S443000, C451S444000, C451S446000
Reexamination Certificate
active
06942548
ABSTRACT:
An abrading plate has a self-stopping capability such that when an object, such as a semiconductor wafer having a device structure that includes raised regions and depressed regions fabricated on the surface, is being polished, the raised regions are removed and polishing stops automatically. The abrading plate, to produce a flat and mirror polished surface on the an object, has abrasive particles having a chemical purity of not less than 90% and a particle size of not more than two micrometers, a binder material, and a given volume of porosity. A ratio of the abrasive particles and the binder material is not less than 1:0.5 by volume, and proportions of abrasive particles, a binder material and porosity are, respectively, not less than 10%, not more than 60% and 10-40% by volume. A surface is polished for a given duration with a liquid not containing abrasive particles so as to eliminate the raised regions and to obtain a flat surface. Additional surface removal is performed by supplying abrasive particles to the polishing interface to remove surface material uniformly from the entire surface.
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U.S. Appl. No. 09/560,562, filed Apr. 28, 2000, (Kazuto Hirokawa et al.).
Hirokawa Kazuto
Hiyama Hirokuni
Matsuo Hisanori
Wada Yutaka
Ebara Corporation
Hail III Joseph J.
McDonald Shantese
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