System and method for self-leveling heat sink for multiple...

Details System and method for self-leveling heat sink for multiple... System and method for self-leveling heat sink for multiple...

2005-09-27

2005-09-27

Cuneo, Kamand (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S676000, C361S689000, C361S688000, C029S760000, C029S834000, C029S854000

Reexamination Certificate

active

06950310

ABSTRACT:
A self-leveling heat sink includes a spring-arm device having at least one aperture and at least one spring-arm is coupled to a substrate. The substrate has at least one package mounted thereon, so that when the spring-arm device is mounted to the substrate the at least one package passes through the at least one aperture. A heat sink operable to remove heat from the at least one package has at least one heat sink post operable to receive a heat sink clip located at the distal end of each of the at least one spring-arms. Each of the at least one spring-arms extending from an inside edge of the at least one aperture and operable to couple the heat sink to the at least one package.

REFERENCES:
patent: 6205026 (2001-03-01), Wong et al.
patent: 6219239 (2001-04-01), Mellberg et al.
patent: 6639800 (2003-10-01), Eyman et al.
patent: 2004/0027807 (2004-02-01), Kashiwagi
patent: 2004/0257786 (2004-12-01), Murasawa

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