Methods of forming semiconductor structures, and articles...

Details Methods of forming semiconductor structures, and articles... Methods of forming semiconductor structures, and articles...

2005-01-04

2005-01-04

Coleman, W. David (Department: 2823)

Semiconductor device manufacturing: process

Chemical etching

Liquid phase etching

C438S756000, C438S757000

Reexamination Certificate

active

06838392

ABSTRACT:
A method of forming a semiconductor structure is described that includes etching a trench in a semiconductor substrate, wherein an oxide layer overlies the semiconductor substrate, and a nitride layer overlies the oxide layer; and cleaning the semiconductor substrate while simultaneously performing a pull back of the nitride layer. Methods of making semiconductor devices and electronic devices, and silicon wafers having trenches and isolation regions formed by the above-mentioned methods are also described.

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