Optical module ground strip

Details Optical module ground strip Optical module ground strip

2005-01-25

2005-01-25

Patel, Dhiru R. (Department: 2831)

Electricity: conductors and insulators

Boxes and housings

With grounding means

C059S006000, C439S098000, C439S092000

Reexamination Certificate

active

06846986

ABSTRACT:
RF emission may be reduced by providing grounding strips between optical transmitter and receiver modules in an optical transceiver package. The grounding strips includes an upper portion to fit over a top of the module, a transition portion to span a distance between the top of the module and the board, and a lower portion in electrical connection with a grounding pad on the board. The grounding strip may be substantially as wide as the module that it covers. Angled tabs may be provided to fit within registration holes in the ground pad. The grounding strip may be press-fitted onto the module or soldered. The low impedance ground strip increases the connectivity of the optical module to the board and may replace grounding leads to the external housing to reduce RF emissions.

REFERENCES:
patent: 5896275 (1999-04-01), Gaeta et al.
patent: 5924877 (1999-07-01), Byrne et al.
patent: 5984697 (1999-11-01), Moran et al.
patent: 6607393 (2003-08-01), Raypole et al.
patent: 6737582 (2004-05-01), Van Lieu et al.

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