Method of manufacturing a bonded wafers using a Bernoulli chuck

Details Method of manufacturing a bonded wafers using a Bernoulli chuck Method of manufacturing a bonded wafers using a Bernoulli chuck

2005-05-24

2005-05-24

Fourson, George (Department: 2823)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

Subsequent separation into plural bodies

C438S464000, C438S977000, C257SE21568, C414S935000, C414S937000, C414S941000

Reexamination Certificate

active

06897124

ABSTRACT:
A bonded wafer27and a residual wafer28are placed in a state of being superimposed on each other on a susceptor20disposed in a heat treatment10. A Bernoulli chuck1is moved to a wafer holding position60on a susceptor20by driving an arm56, sucks the bonded wafer27positioned on the upper side and then moves to a bonded wafer recovery table50′ to recover the bonded wafer there. Then, similarly, the Bernoulli chuck1suction holds the residual wafer28at the wafer holding position60and then moves to a residual wafer recovery table50″ to recover the residual wafer there. With such a construction adopted, in a method for manufacturing a bonded wafer according to a so-called smart-cut method, not only is the separated bonded wafer recovered suppressing occurrence of a defect, deficiency and contamination, but there is also provided a method for manufacturing a bonded wafer capable of automation suitable for mass production.

REFERENCES:
patent: 5374564 (1994-12-01), Bruel
patent: 6527031 (2003-03-01), Yanagita et al.
patent: 0 961 312 (1999-12-01), None
patent: 0 999 575 (2000-05-01), None
patent: 5-21128 (1994-12-01), None
patent: 2000-36583 (1999-12-01), None
patent: 2000-077287 (2000-03-01), None
patent: 2000-0150456 (2000-05-01), None
patent: 2001-094081 (2001-04-01), None

Affiliated with

Also associated with

Rating

Method of manufacturing a bonded wafers using a Bernoulli chuck does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacturing a bonded wafers using a Bernoulli chuck, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing a bonded wafers using a Bernoulli chuck will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3419572