Polishing apparatus

Details Polishing apparatus Polishing apparatus

2005-09-06

2005-09-06

Rose, Robert A. (Department: 3723)

Abrading

Abrading process

With tool treating or forming

C451S072000, C451S443000

Reexamination Certificate

active

06939208

ABSTRACT:
The present invention relates to a polishing apparatus for polishing a workpiece, such as a semiconductor wafer, to a flat mirror finish. The polishing apparatus comprises a polishing table having a polishing surface, and a top ring, and the workpiece is interposed between the polishing table and the top ring, and pressed at a predetermined pressure to polish the workpiece. The polishing apparatus comprises at least two dressing units for dressing the polishing surface by being brought into contact with the ppolishing surface, which is a surface of a polishing cloth.

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