Surface joined multi-substrate liquid metal switching device

Details Surface joined multi-substrate liquid metal switching device Surface joined multi-substrate liquid metal switching device

2005-03-29

2005-03-29

Enad, Elvin (Department: 2832)

Electricity: circuit makers and breakers

Liquid contact

C200S193000

Reexamination Certificate

active

06872903

ABSTRACT:
A device and manufacturing method are provided comprising first and second substrates comprising a main channel provided in at least one of the substrates and a first connecting channel provided in at least one of the substrates and in fluid communication with the main channel. The main channel comprising spaced apart electrodes and filling the main channel at least partially with liquid metal. The method further comprising a first heater substrate comprising a first suspended heater element in fluid communication with the first connecting channel with the first suspended heater element operable to cause a fluid non-conductor to separate the liquid metal and selectively interconnect the electrodes and surface joining the first, second, and first heater substrates.

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patent: 6822175 (2004-11-01), Kondoh et al.
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U.S. Appl. No. 10/627,308, filed Jul. 25, 2003, Kondoh et al.
U.S. Appl. No. 10/173,383, filed Jun. 14, 2002, Wong et al.

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