Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead
Reexamination Certificate
2005-07-12
2005-07-12
Pham, Long (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
C257S735000, C257S781000, C257S782000
Reexamination Certificate
active
06917104
ABSTRACT:
First and second electrodes and first and second electrical connection portions are overlapped and electrically connected. A first substrate includes: an attachment portion, a connection portion and an extension portion, the attachment portion being attached to the second substrate, the connection portion being connected to the attachment portion and positioned outside the second substrate, and the extension portion being extending from the connection portion along an edge of the second substrate without overlapping the second substrate. The first electrical connection sections are formed on the extension portion of the first substrate.
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Hogan & Hartson LLP
Le Thao X.
Pham Long
Seiko Epson Corporation
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