Method for forming an encapsulation device

Details Method for forming an encapsulation device Method for forming an encapsulation device

2005-05-17

2005-05-17

Arbes, Carl J. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S825000, C029S830000

Reexamination Certificate

active

06892453

ABSTRACT:
An improved die edge contacting socket incorporates particles of a thermally conducting material into an elastomeric compression pad disposed in the sealing cap of the socket. The elastomeric compression pad is preferably composed of an electrically insulating material, such as a silicone-based gel. The thermally conducting material is preferably either diamond, beryllium oxide, silicon nitride, or a like material.

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