Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2005-05-17
2005-05-17
Pham, Long (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
Reexamination Certificate
active
06894384
ABSTRACT:
A recessed portion of an adhesive is formed between a wiring board and a heat spreader. Voids occur in the neighborhood of the top of each metal thin wire upon curing an encapsulating resin, thus causing a reduction in moisture resistance. Therefore, the present invention provides a semiconductor device wherein a semiconductor chip and a wiring board are fixed to a heat spreader by an adhesive layer formed over a principal surface of the heat spreader, by using a method such as thermocompression bonding to thereby eliminate a recessed portion, and the parts are sealed with an encapsulating resin inclusive of the semiconductor chip and the metal thin wires.
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Farahani Dana
Oki Electric Industry Co. Ltd.
Rabin & Berdo PC
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