Ultrasonic-wave washing unit, ultrasonic-wave washing...

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means

Reexamination Certificate

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C438S693000, C438S795000

Reexamination Certificate

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06875696

ABSTRACT:
An ultrasonic-wave washing unit comprising an ultrasonic-wave vibrating plate to which an ultrasonic-wave vibrator is fixed by adhesive bonding, an ultrasonic-wave transmission plate opposed to the vibrating plate, a liquid supply means which supplies a liquid to a space defined between the vibrating plate and the transmission plate, and a liquid discharge means for discharging the liquid from the space.

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