Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2005-04-05
2005-04-05
Cuneo, Kamand (Department: 2813)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
C257S704000, C257S710000, C257S666000, C438S064000, C438S111000, C438S123000, C438S125000, C029S465000, C029S740000, C029S832000, C361S737000
Reexamination Certificate
active
06875631
ABSTRACT:
A CF card (1) comprises: a casing constituted by two panel plates (2, 2) and a frame (3); and a printed wiring board (4) accommodated in the casing. A plurality of claw-like engaging parts (5) are provided to the peripheries of the panel plates (2). When the CF card (1) is assembled, the engaging parts (5) of the first panel plate (2) are inserted into through holes of a long groove (8) provided in the frame (3) and then the printed wiring board (4) is mounted on the panel plate (2) located at the inside of the frame (3). Thereafter, the engaging parts (5) of the second panel plate (2) are inserted into the through holes of the long groove (8) from the surface located in the opposite side of the frame (3). There are two types of engaging parts (5): one having lances and the other having holes. Inside the through holes, the lances of the engaging parts (5) of one panel plate (2) are inserted into the holes of the engaging parts (5) of the other panel plate (2).
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Katsumata Akira
Kudaishi Tomoaki
Nishizawa Hirotaka
Tanaka Hideki
Yamada Yuichiro
Cuneo Kamand
Hitachi ULSI Systems Co. Ltd.
Mitchell James M.
Sanwa Denki Kogyo Co., Ltd.
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