Method and system for integrated circuit packaging

Details Method and system for integrated circuit packaging Method and system for integrated circuit packaging

2005-07-19

2005-07-19

Cao, Phat X. (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Housing or package filled with solid or liquid electrically...

C257S787000

Reexamination Certificate

active

06919629

ABSTRACT:
According to one embodiment of the invention, a mold tool for packaging integrated circuits includes a first mold press die including a first non-planar surface and a second mold press die including a second non-planar surface. The first and second non-planar surfaces form the upper and lower surfaces of a mold cavity when the first and second mold press die are engaged. The mold tool also includes a bright TiN coating disposed on the first non-planar surface. The bright TiN coating operates to decrease residue on the first non-planar surface from a mold compound. The mold compound is distributed into the mold cavity to form a package operable to encapsulate an integrated circuit.

REFERENCES:
patent: 6114189 (2000-09-01), Chia et al.
patent: 6791198 (2004-09-01), Street et al.
patent: 2004/0183175 (2004-09-01), Terui et al.

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