Method of manufacturing a light emitting semiconductor package

Details Method of manufacturing a light emitting semiconductor package Method of manufacturing a light emitting semiconductor package

2005-04-12

2005-04-12

Thompson, Craig A. (Department: 2813)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Packaging or treatment of packaged semiconductor

C438S007000, C438S065000, C438S116000, C257S432000, C257S433000, C257S434000, C257S680000

Reexamination Certificate

active

06878564

ABSTRACT:
A method of manufacturing a light emitting semiconductor package, the method comprising the steps of: obtaining a semiconductor wafer252which includes a plurality of light emitting devices254residing on or in a surface of the semiconductor wafer252; forming at least one first hollow cap256, each first hollow cap256formed to provide: a central portion260and first perimeter walls extending from the perimeter edge of the central portion with the free edges of the first perimeter walls adapted to be bonded to the surface of the semiconductor wafer252to provide a first cavity; at least one region258of the central portion260which is substantially transparent or translucent to electromagnetic radiation; bonding the at least one first hollow cap256to the semiconductor wafer252, the central portion overlying at least one of the plurality of light emitting devices254; and, separating the semiconductor wafer252with bonded caps256into light emitting semiconductor packages250.

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