Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate
2005-01-11
2005-01-11
Picardat, Kevin M. (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified material other than unalloyed aluminum
C257S762000, C438S614000, C438S642000, C438S652000, C438S687000
Reexamination Certificate
active
06841877
ABSTRACT:
A means for highly precisely and economically fabricating wiring on a semiconductor and highly precisely and economically forming a bump on an electrodes. (1) A semiconductor device comprising a semiconductor, a metal foil for fabricating wiring and conductor wiring on the semiconductor, and a method of fabricating a conductor wiring circuit on a semiconductor, comprising the steps of laying a metal foil for fabricating wiring on the electrode-forming side of the semiconductor, forming a resist wiring pattern by photo-etching the metal foil, etching the metal foil, and removing the resist to form the wiring. (2) A semiconductor device which comprises a multilayer metal foil for fabricating wiring in place of the metal foil for forming wiring of the semiconductor device described in (1); and a method of fabricating conductor wiring having a bump on a semiconductor, comprising the steps of the method described in (1) and further comprising the steps of forming a resist pattern for forming the bump by photo-etching the multilayer metal foil for forming the wiring, forming a bump by selective etching, and removing an etch-stop layer.
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Saijo, Kinji et al. “Method of Manufacturing Metal Foil/Ceramics Joining Material and Metal Foil Laminated Ceramic Substrate,” Nov. 18, 1999.
Kawakzoe, Hiroshi et al. “Inspection Board for Semiconductor Device and Its Production,” Jan. 12, 1996.
Yamazaki, Akio et al. “Manufacture of Wiring Board with Bump and Semiconductor Package,” Mar. 9, 1999.
Ohsawa Shinji
Okamoto Hiroaki
Saijo Kinji
Yoshida Kazuo
Browdy and Neimark , P.L.L.C.
Picardat Kevin M.
Toyo Kohan Co. Ltd.
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