Film forming method

Details Film forming method Film forming method

2005-03-29

2005-03-29

Jolley, Kirsten (Department: 1762)

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

C427S240000, C427S261000, C427S265000, C427S350000, C427S377000, C427S397700, C427S419200, C427S425000, C118S052000, C118S320000, C438S778000, C438S782000

Reexamination Certificate

active

06872418

ABSTRACT:
A method for forming a film using a rotating cup application apparatus in which a rotatable inner cup is provided within an outer cup, the upper openings of the inner cup and the outer cup are closed with corresponding lids, and the lid for the inner cup is integrally rotated together with the inner cup, the method comprising the steps of setting a material to be treated, on which wiring layers have been formed, in the rotating cup application apparatus, applying SOG onto the surface of the material to be treated, thereafter closing the upper openings of the inner cup and the outer cup with the lids, rotating the inner cup in this state to thereby uniformly diffusing the SOG, repeating the SOG application and diffusing steps, and thereafter baking the material to be treated in a heat treatment apparatus.

REFERENCES:
patent: 5312512 (1994-05-01), Allman et al.
patent: 5453406 (1995-09-01), Chen
patent: 5554567 (1996-09-01), Wang
patent: 5707687 (1998-01-01), Ueda et al.
patent: 5985363 (1999-11-01), Shiau et al.
patent: 6214104 (2001-04-01), Iida et al.
patent: 6277441 (2001-08-01), Endo et al.
patent: 6313044 (2001-11-01), Lee
patent: 3-30453 (1991-02-01), None
patent: 07-227568 (1995-08-01), None

Affiliated with

Also associated with

Rating

Film forming method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Film forming method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Film forming method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3410679