Monolithically integrated microwave guide component for...

Wave transmission lines and networks – Coupling networks – With impedance matching

Reexamination Certificate

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C333S246000

Reexamination Certificate

active

06919773

ABSTRACT:
A monolithically integrated microwave guide component for overcoupling high frequencies includes a first micro-waveguide that is structured on a micro-waveguide chip, and comprises a second micro-waveguide that is structured on a carrier substrate. The microwave guides are contacted to one another by a chip through-plating. The microwave guides each include, in the contact region, an integrated compensating structure that serves to compensate for reflections.

REFERENCES:
patent: 4494083 (1985-01-01), Josefsson et al.
patent: 5093640 (1992-03-01), Bischof
patent: 0 318 311 (1989-05-01), None
T.E. Kazior, et al. “A Manufacturable, Bond Wire Free Interconnect Technology for Microwave and Millimeter Wave MMICs” Jun. 1997 (4 pages).
Derrell Hill “Low Thermal Impedance MMIC Technology”, Feb. 1997 IEEE Microwave and Guided Wave Letters.
Hua_Quen Tserng, et al. “Embedded Transmission-Line (ETL) MMIC for Low-Cost High-Density Wireless Communication Applications” 1997 (8 pages).
E. Holzman, et al. “An Hermetic Coplanar Waveguide-to-HDI Microstrip Microwave Feedthrough” 1998 (2 pages).
Gary S. Barta, et al. “Surface-Mounted GaAs Active Splitter and Attenuator MMIC's Used in a 1-10-GHz Leveling Loop” 1986 (5 pages).

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