Porous adhesive sheet, semiconductor wafer with porous...

Details Porous adhesive sheet, semiconductor wafer with porous... Porous adhesive sheet, semiconductor wafer with porous...

Filed on

2005-05-10

Date issued

2005-05-10

Examiner

Morris, Terrel (Department: 1771)

Patent Class

Stock material or miscellaneous articles

SubClass

Structurally defined web or sheet

SubSubClass

Including aperture

Other Related Categories

C428S901000, C428S343000, C428S3550RA, C174S264000, C174S262000

Type

Reexamination Certificate

Status

active

Patent number

06890617

Description

ABSTRACT:
A porous adhesive sheet1having plural through holes2running in about parallel with each other in the thickness direction A of an adhesive organic film3, wherein the through holes have about congruent sections in the diameter direction from one opening2ato the other opening2band a production method thereof, and a semiconductor wafer with a porous adhesive sheet31, which includes a semiconductor wafer32having an electrode33, the porous adhesive sheet1adhered to the semiconductor wafer, and a conductive part34formed by filling a through hole2located on the electrode33with a conductive material, and a production method thereof are provided.

REFERENCES:
patent: 4346700 (1982-08-01), Dunshee et al.
patent: 4404243 (1983-09-01), Terpay
patent: 4666751 (1987-05-01), Pasquali et al.
patent: 4806111 (1989-02-01), Nishi et al.
patent: 5093202 (1992-03-01), Mariaggi et al.
patent: 5300618 (1994-04-01), Durairaj
patent: 5435480 (1995-07-01), Hart et al.
patent: 5576518 (1996-11-01), Shibuya et al.
patent: 5604026 (1997-02-01), King
patent: 6075080 (2000-06-01), Katsuoka et al.
patent: 6121553 (2000-09-01), Shinada et al.
patent: 6245175 (2001-06-01), Hotta et al.
patent: 0560072 (1993-09-01), None
patent: 560072 (1993-09-01), None
patent: WO 9733946 (1997-09-01), None

Affiliated with

Also associated with

Rating

Porous adhesive sheet, semiconductor wafer with porous... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Porous adhesive sheet, semiconductor wafer with porous..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Porous adhesive sheet, semiconductor wafer with porous... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3409617