Metal fusion bonding – Process – Plural joints
Reexamination Certificate
2005-04-12
2005-04-12
Cooke, Colleen P. (Department: 1754)
Metal fusion bonding
Process
Plural joints
C228S226000, C228S248100
Reexamination Certificate
active
06877653
ABSTRACT:
A method of modifying the tin to lead ratio of a tin-lead bump forms a patterned solder mask over a substrate that comprises a first tin-lead bump formed thereon, the patterned solder mask having an opening that exposes the tin-lead bump. A solder material including tin and lead is filled in the opening of the solder mask over the first tin-lead bump. The solder material has a tin to lead ratio that differs from that of the first tin-lead bump. The solder material is reflowed to fuse with the first tin-lead bump, which forms a second tin-lead bump. The tin to lead ratio of the second tin-lead bump is thereby different from that of the first tin-lead bump.
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Chen Jau-Shoung
Chou Yu-Chen
Fang Jen-Kuang
Huang Min-Lung
Lee Chun-Chi
Advanced Semiconductor Engineering Inc.
Cooke Colleen P.
Jianq Chyun IP Office
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