Pin retention for thermal transfer interfaces, and...

Details Pin retention for thermal transfer interfaces, and... Pin retention for thermal transfer interfaces, and...

2005-03-15

2005-03-15

Chervinsky, Boris (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S707000, C361S717000, C165S080300, C165S185000, C257S718000, C257S727000

Reexamination Certificate

active

06867976

ABSTRACT:
Structure and methods are disclosed for transferring thermal energy from an object to a thermal spreader. A plurality of pins are biased against the object so that the plurality of pins contact with, and substantially conform to, a macroscopic surface of the object. Thermal energy is communicated from the object through the pins and through a plurality of air gaps between the pins and the thermal spreader. The pins are retained to the passageways of the thermal spreader so that the pins are retained with the thermal spreader when unbiased against the object.

REFERENCES:
patent: 4381032 (1983-04-01), Cutchaw
patent: 4639829 (1987-01-01), Ostergren et al.
patent: 4928207 (1990-05-01), Chrysler et al.
patent: 5097385 (1992-03-01), Chao-Fan Chu et al.
patent: 5247425 (1993-09-01), Takahasi
patent: 5294830 (1994-03-01), Young et al.
patent: 5390076 (1995-02-01), Umezawa
patent: 5394299 (1995-02-01), Chu et al.
patent: 5463528 (1995-10-01), Umezawa
patent: 6223815 (2001-05-01), Shibasaki
patent: 6404638 (2002-06-01), Messina
patent: 58166750 (1983-10-01), None

Affiliated with

Also associated with

Rating

Pin retention for thermal transfer interfaces, and... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Pin retention for thermal transfer interfaces, and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Pin retention for thermal transfer interfaces, and... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3408494