Method of forming noble metal thin film pattern

Details Method of forming noble metal thin film pattern Method of forming noble metal thin film pattern

2005-05-10

2005-05-10

Olsen, Allan (Department: 1763)

Etching a substrate: processes

Forming or treating mask used for its nonetching function

C427S125000

Reexamination Certificate

active

06890447

ABSTRACT:
A sacrificial film is formed on a substrate and a mask layer is formed on the sacrificial film. An opening having a predetermined pattern is formed through the mask layer. The sacrificial film exposed in the opening is removed to form a cave broader than the opening on the substrate. A noble metal thin film is deposited on the whole substrate surface. The sacrificial film12is dissolved and removed to form a noble metal thin film pattern.

REFERENCES:
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patent: 5091342 (1992-02-01), Studebaker et al.
patent: 5610090 (1997-03-01), Jo
patent: 64-65876 (1989-03-01), None
patent: 6-21052 (1994-01-01), None
patent: 6-267843 (1994-09-01), None
patent: 7-70817 (1995-07-01), None
Copy of Korean Office Action dated Jul. 22, 2004 (and English translation of relevant portion).

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