Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2005-01-25
2005-01-25
Chambliss, Alonzo (Department: 2827)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S124000, C438S613000, C228S180220
Reexamination Certificate
active
06846700
ABSTRACT:
A microelectronic assembly including elements such as a semiconductor chip and substrate has electrical connections between the elements incorporating fusible conductive metal masses. The fusible masses are surrounded and contained by a compliant material such as an elastomer or gel. The fusible material may melt during operation or processing of the device to relieve thermal cycling stress in the electrical connections.
REFERENCES:
Office Action mailed Oct. 9, 2003 relating to Application No. 10/371324
Chambliss Alonzo
Lerner David Littenberg Krumholz & Mentlik LLP
Tessera Inc.
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